| Activities |
| Quantum-Film, Quantum-Wire,
and Quantum-Box Lasers |
Staffs: Y. Suematsu S. Arai M. Asada M. Watanabe S.
Tamura Visiting Researcher: G. Bacher Students:
M. Tamura T. Kojima M. Madhan Raj N. Serizawa X. Y. Jia T. Ando
S. Peng H. Nakaya K. Numata S. Tanaka N. Nunoya S.Toyoshima
T. Numaguchi Y. Hayafune H. Yasumoto M. Nakamura |
| @ |
| GaInAsP/InP strained-quantum-film, -wire, and -box lasers
have been studied both theoretically and experimentally.
Results obtained in this research are as follows: |
| @ |
(1) Drive current of a directly modulated semiconductor laser
for optical parallel interconnection was investigated by taking
into account of both the threshold current and the differential
quantum efficiency. As the results, it was found that the laser
cavity design which yields the minimum drive current is almost
the same condition to achieve the minimum threshold current
whereas the cavity design for higher differential quantum efficiency
is required when the total system loss is much higher. When
the cavity length is 100mm and the
rear mirror reflectivity Rr is 0.99, the front
mirror reflectivity Rf which gives the minimum
drive current was obtained to be 0.94, 0.91, and 0.8 for the
total system loss of 6dB, 10dB, and 20dB, respectively.
(2) The photon recycling effect in quantum film (Q-film), quantum
wire (Q-wire), and a quantum box (Q-box) has been theoretically
investigated using rate equation analysis and the density-matrix
method. The threshold reductions due to photon recycling in
Q-film, Q-wire, and Q-box, in the case of lattice matched (LM)
Ga0.47In0.53As/InP are 40%, 24%, and 0%,
respectively, for a fixed cavity loss of lasing mode normalized
by the optical confinement factor hL/hL=50
cm-1. The estimation also shows that photon recycling
is more effective in compressively-strained (CS) Ga0.18In0.82As0.73P0.27/InP
quantum structures than in LM quantum structures. In both cases,
the threshold reduction due to photon recycling is larger in
the Q-film than in Q-wire and Q-box.
(3) Polarization dependence of 1.5mm
wavelength GaInAsP/InP quantum-wire structures fabricated by
EB lithography and two-step OMVPE growth were measured and compared
with quantum-film structures fabricated on the same wafer. As
the result, clear anisotropic PL properties of the quantum-wire
structure corresponding to the wire width (25nm and 35nm) were
confirmed. This anisotropy was observed to be a little stronger
in 1% compressively-strained quantum-wire structure than that
in lattice-matched one with the same wire width (35nm).
(4) Temperature dependence of GaInAsP/InP compressively-strained
single-quantum-well lasers with quantum-wire (Q-Wire) size active
region were measured and compared with those of quantum-film
lasers. Lower threshold current as well as higher differential
quantum efficiency operation of Q-Wire laser than those of Q-Film
laser at a temperature below 200K were obtained. Threshold current
density of Q-Wire laser was 34A/cm2 which was almost
a half that of Q-Film laser being 68A/cm2 at T =
90K.
(5) Gain spectra of 1.5mm wavelength
GaInAsP/InP quantum-wire lasers (W=20, 25nm) were measured and
compared with quantum-film lasers prepared on the same wafer.
As a result, narrower gain spectra of the quantum-wire lasers
were obtained at T = 100K.
(6) 50nm-period GaInAsP/InP quantum-wire lasers (W`20nm) were
fabricated using EB lithography and wet etching followed by
OMVPE embedding growth, and measured the cavity length dependence
of the differential quantum efficiency. As the result, xi`1.0
and kWG`4.5cm-1
were obtained at T=90K.
(7) Realization of room temperature operation of Multiple Microcavity
laser consisting of l/4-air gap (=
0.39mm) and semiconductor reflectors
was fabricated using two steps organometallic vapor-phase epitaxy
(OMVPE) and two steps wet chemical etching. The threshold current
was measured to be 78mA (Jth = 1.25kA/cm2)
for a total cavity length 164mm (Pitch:
20mm; 8 elements) and stripe width
of 40mm, and an effective power reflectivity
of this cavity structure was estimated to be higher than 92%. |
| @ |
| Semiconductor
Photonic Device |
Staffs: Y. Suematsu@S. Arai@Y. Miyamoto@S. Tamura
Post-Doctoral Research Fellow: M. M. Raj@B. Chen
Visiting Researcher: J.-I. Shim Students:
T. Takizawa A. Uchino T. Shimizu Y.
Takeuchi S. Yamazaki |
| @ |
| Semiconductor directional-coupler-type all-optical switching
devices with tapered-shape structures were proposed and analyzed
by numerical simulations. Moreover a GaInAs/InP multiple-quantum-well
directional-coupler-type all-optical switch was fabricated
and its low switching power operation was demonstrated.
Results obtained in this research are as follows: |
| @ |
(1) A semiconductor directional-coupler-type all-optical switch
with tapered-shape structures, based on the nonlinear refractive
index variation induced by photoexcited carriers, was proposed
and its taper-shape dependence was investigated. By the numerical
simulation, it is shown that an introduction of tapered-shape
structures is effective for the improvement of the extinction
ratio. It is also found that this device can drive the signal
light of about 17dB higher power than the switching power.
(2) A GaInAs/InP multiple-quantum-well (MQW) directional-coupler-type
all-optical switch utilizing the carrier-induced nonlinearity
was fabricated and its low switching power operation was demonstrated
at 1.55mm wavelength. Extinction
ratios at each output port of 2.3dB and 2.6dB were obtained
with low switching light power of 5.9mW at the input fiber end.
(3) Multiple-quantum-well directional-coupler-type all-optical
switches having various waveguide widths were fabricated using
CH4/H2 RIE dry etching and FIB (Focused
Ion Beam) techniques. Comparison between the theory and experimental
results were carried out by Crosstalk measurement on the waveguide.
The result shows that the permissible fabrication error of the
waveguide should be less than }160nm and also a high value of
Crosstalk up to 29dB were experimentally confirmed. |
| @ |
| Processing for Nanometer
Structures |
Staffs: K. Furuya S. Arai Y. Miyamoto M. Watanabe M.
Suhara S. Tamura Visiting Researcher: G. Bacher
Students: H.Hongo M. Tamura T. Kojima H. Honji X. Y.
Jia T. Ando H. Hattori H. Nakaya A. Kokubo S. Tanaka N. Nunoya
K.Sato Y. Hayafune H. Nakamura H. Yasumoto M. Nakamura M.Nakamura
E. Zhang |
| @ |
Study of nanometer structure fabrication technology is important
for the realization of quantum effect devices such as quantum-wire,
or -box devices and ballistic electron devices based on wave
characteristics of electrons.
Results obtained in this research are as follows:
|
| @ |
| (1) Sidewall recombination velocity of GaInAsP/InP wire
structures fabricated by CH4/H2-ECR-RIBE
was estimated from PL intensity dependence on the wire width.
As the result, a reduction of surface damage was observed.
(2) In EB lithography, the size distribution of dense multiple
wire patterns (period: 50 nm) formed on EB-resist (ZEP-520)
was measured and its deviation was reduced by proximity effect
correction.
(3) A 25-nm pitch GaInAs/InP buried structure was fabricated
by electron beam lithography with Calixarene resist and two-step
wet chemical etching. The fabrication of 20nm pitch would
be possible by reduction of stage instability of system that
is in progress.
(4) Si delta-doping by organometallic vapor phase epitaxy
(OMVPE) onequidistant monolayer steps was studied towards
the dopant-ordering in semiconductors. Growth condition conserving
monolayer steps after the delta-doping was investigated in
InP with respect to disilane flow and growth temperature.
Transport anisotropy in the delta-doped layer is studied by
measuring sheet resistance along parallel and perpendicular
to the monolayer step.
(5) Si delta-doping by organometallic vapor phase epitaxy
(OMVPE) onequidistant monolayer steps was studied towards
the dopant-ordering in semiconductors. Growth condition conserving
monolayer steps after the delta-doping was investigated in
InP with respect to disilane flow and growth temperature.
Transport anisotropy in the delta-doped layer is studied by
measuring sheet resistance along parallel and perpendicular
to the monolayer step. |