Low Dimensional Quantum Structure Lasers

 

Staffs:    Y. Suematsu  S. Arai   T. Maruyama            S. Tamura

Visiting Researcher:        A. Haque

Post-Doctoral Research Fellow:           N. Nunoya

Students:       H. Yagi      K. Muranushi           K. Ohira           A. Onomura      T. Sano

                    T. Murayama    P. Dhanorm

 

GaInAsP/InP strained-quantum-film, -wire, and -box lasers have been studied both theoretically and experimentally. A new type of DR (distributed reflector) lasers fabricated by the same fabrication process as that of quantum-wire lasers and distributed feedback (DFB) lasers with wirelike active regions have been also studied.

Results obtained in this research are as follows:

 

(1)      1.5-mm-wavelength partially strain-compensated GaInAsP/InP 5-layered quantum-wire lasers with the wire width of 23 nm in the period of 80 nm were realized for the first time by electron beam lithography, CH4/H2-reactive ion etching and organometallic vapor-phase-epitaxial regrowth. The threshold current density of 774 A/cm2 and differential quantum efficiency of 40 % were obtained under a pulsed condition at room temperature. From measurement of spontaneous emission spectra, the blue shift at the peak wavelength was 38 meV, which was much larger than a calculated value. The spontaneous emission spectral width was almost constant at temperatures between 103 K and 263 K, indicating a lateral quantum confinement effect. Finally, the spontaneous emission efficiency below the threshold was comparable to that of the Q-Film lasers up to 85 ‹C, which revealed the low-damage property of the etched/regrown interfaces.

(2)      GaInAsP/InP partially strain-compensated multiple-quantum-wire lasers with the wire widths of 18 nm and 27 nm in the period of 80 nm were fabricated by electron beam lithography, CH4/H2-reactive ion etching and organometallic vapor-phase-epitaxial regrowth. Size distributions of these quantum-wire structures were measured by scanning electron microscope views and the standard deviation was obtained to be less than 2 nm. The differential quantum efficiencies of these quantum-wire lasers were almost the same as those of the 5-quantum-well lasers at room temperature. From EL spectra of various wire width lasers, a larger energy blue shift than that predicted by a simple analysis model was observed.

(3)      Wire width dependence of the large energy blue shift in GaInAsP/InP partially strain-compensated vertically-stacked multiple-quantum-wire structures is accurately explained for the first time using an 8 band k•p theory without any fitting parameter. Variations of energy levels due to a non-uniform strain profile in stacked quantum-wires are calculated to be less than 2.4 meV. It is found that unlike quantum films, the energy-band structures of strained quantum-wires depend on the amount of strain-compensation in barrier regions and on the number of wire layers in the vertical stack.

(4)      A RT-CW operation of GaInAsP/InP quantum-wire lasers (23 nm wide, 5 stacked quantum-wires) and quantum-wirelike lasers (43 nm wide, 5 stacked wires) fabricated by electron beam lithography, CH4/H2-reactive ion etching and 2-step organometallic vapor-phase-epitaxial growth processes was realized for the first time. Lifetime measurement of this quantum-wire laser was also carried out at RT-CW condition, and no noticeable degradation in light output was observed even after 2,000 hours.

(5)      High-performance 1.55 mm wavelength GaInAsP/InP strongly index-coupled and gain-matched distributed feedback lasers with periodic wirelike active regions were fabricated by electron beam lithography, CH4/H2-reactive ion etching, and organometallic vapor-phase epitaxial regrowth. This type of DFB laser with wirelike active regions can operate at very low threshold because of its strong index coupling and the reduction of the active medium volume. However, this type of DFB laser consists of a larger portion of etched/regrowth interfaces than conventional DFB laser. Therefore the reliability test of lasing characteristics is very important. A CW life test was carried out. No degradations in lasing characteristics were observed after an aging time of 8200 hours at a bias current of around 10 times the threshold.

(6)      By using a lateral quantum confinement effect, a new type of distributed reflector laser consisting of a wirelike active section and a passive DBR section with quantum-wire structure was demonstrated for the first time. In theoretical analysis, a waveguide loss of a DBR structure increases by only 1 cm-1 compared with the value in case of no active layers. Using this waveguide structure as a passive DBR section, a maximum reflectivity of 97 % would be obtained for the wire width of 40 nm and DBR section length of 200 mm. Threshold current of 15.4 mA, which corresponds to the threshold current density of 320 A/cm2, was obtained for the active section length of 240 mm, the passive DBR section length of 440 mm and the stripe width of 20 mm with both facets cleaved. The differential quantum efficiency from the front facet was 16.2 % and the rear facet was 0.57 %, hence an asymmetric output ratio of 28 was realized. This strong asymmetric output characteristic is a specific property of the DR laser. For a lower threshold and a single-mode operation, narrow stripe DR laser was also fabricated. As a result, Threshold current of 7.6 mA and differential quantum efficiency from the front facet of 5.1 % were obtained under RT-CW condition for the active section length of 310 mm, the passive section length of 270 mm and the stripe width of 3 mm. A single-mode operation with sub-mode suppression ratio (SMSR) of 40 dB was achieved at relatively low bias level (I=1.2Ith).

 

 

 


New Types of Semiconductor Lasers for Photonic Integration

 

Staffs:    Y. Suematsu  S. Arai   S. Tamura

Post-Doctoral Research Fellow:           N. Nunoya

Students:       H. –C. Kim         T. Okamoto     Y. Onodera        H. Kanjo           T. Hasegawa

                    T. Yamazaki

 

Semiconductor lasers with low threshold current, high efficiency, and single wavelength operation are very attractive for optical interconnection and a number of optoelectronics applications. New types of semiconductor lasers, such as Distributed Reflector (DR) lasers and Membrane lasers have been studied both theoretically and experimentally.

Results obtained in this research are as follows:

 

(1)      1.3mm-wide narrow mesa stripe DR lasers consisting of first-order vertical grating (VG)-DFB and first-order deeply etched DBR mirrors were realized for the first time by one-step epitaxy and fine vertical etching processes. A threshold current of 3.6mA for the active region length of 210mm and an SMSR=35dB were obtained.

(2)      By use of vertical grating DFB structure, it is clarified that structural birefringence can be drastically reduced. The grating coupling coefficient can also be made polarization insensitive by adjusting the grating depth.

(3)      Novel semiconductor laser structure, such as, membrane laser which has the Benzocyclobutene (BCB) cladding layers, enables to increase optical confinement into active layer due to a large refractive index difference between active layer and cladding layers. A room temperature continuous wave operation of membrane DFB laser consisting of deeply etched single-quantum-well wirelike active regions was already demonstrated. In order to realize single mode and low threshold operation of membrane DFB laser, buried heterostructure (BH) was innovated by slightly changing the fabrication process. A threshold pump power of 1.5 mW and a sub-mode suppression-ratio of 42 dB were obtained for a 142 nm-thick semiconductor membrane core layer with a cavity length of 120 mm and a stripe width of 2 mm under room-temperature continuous wave optical pumping. The corresponding threshold for current injection was roughly estimated to be 27 mA.

(4)      We have realized membrane BH-DFB laser arrays by arranging the laser cavities (10 mm spaced 15 elements with 5 different grating periods). A total wavelength span of 72 nm was achieved with a small lasing wavelength fluctuation of up to }1.2 nm at RT-CW condition under optical pumping. From this value, membrane thickness fluctuation was estimated to be }0.4 nm. Threshold pump power of 3.4 mW and SMSR of 45 dB were achieved in a typical device.

(5)      Membrane BH-DFB laser arrays with different grating periods and different stripe width were successfully fabricated using EB lithography, CH4/H2-RIE and OMVPE. The possibility for a laser array covering a wide wavelength range of 51 nm with a wavelength controllability of less than 0.8 nm (100GHz) was demonstrated. This multi-wavelength laser array may be a candidate for a coarse WDM system or a wavelength conversion device between LAN and MAN.

 


Quantum Coherent Electron Devices

 

Staffs:    K. Furuya     Y. Miyamoto      N. Machida   S. Tamura

Post-Doctoral Research Fellow:           M. Nagase

Students:       T. Hirata     T. Okada     K. Mae    H. Nagatsuka       Y. Ninomiya             M. Fukasawa        

                    H. Kanoh    D. Miyamoto     U. Shirai       T. Kaminosono         S. Sato    Y. Toriumi

 

Ballistic transport of hot electron has a possibility of new high-speed and functional devices using wave property of electron. We studied wave properties of hot electron for new principle of electron devices.

Results obtained in this research are as follows:

 

(1) A new experimental method using ballistic electron emission microscope (BEEM) for observation of electron wave diffraction in semiconductor is proposed and numerical simulations of the experiment were performed in order to clarify conditions for the observation. A material combination of GaInAs/InP showed a clear diffraction pattern due to a phase shift structure as a cause of wavefront modulation. The diffraction pattern still appeared when an energy spread of 200 meV of electrons in BEEM current were assumed. This energy spread allows BEEM current to be over 1 pA when the tunneling current is set to 10 nA and the current level is large enough to be detected by ordinal BEEM system.

(2) We have analyzed experimental data of hot-electron current modulation by magnetic field measured for fabricated semiconductor double-slit device. Electron motions through double-slit and single slit were numerically calculated by the quantum beam propagation method and classical particle dynamics. The experimental results could not be explained by double-slit interference. However, quantum wave diffraction and classical particle picture could explain the experimental results if the double slit worked effectively as single slit. This can be considered to occur either when the double-slit was collapsed to be single slit or when wavefront spread of emitted electron beam were smaller than the slit spacing.

(3) At sufficiently low temperatures, e.g., below 10 K, current in I-V characteristics of double-barrier resonant-tunneling diodes (DBRTDs) in the low-current and low-voltage region is inversely proportional to the phase coherence length. However, with increasing temperature, this proportional behavior no longer holds due to thermal energy spread around the Fermi energy in the emitter. In this study, the temperature range in which current amplitude is inversely proportional to the phase coherence length is theoretically derived. The temperature range is dependent on the structural parameters of DBRTDs. By choosing appropriate device parameters, we can make the current amplitude inversely proportional to the phase coherence length even at relatively high temperatures, e.g., 77 K. These results are highly useful for estimating electron phase coherence length over a wide temperature range and for studying the temperature dependence of the phase coherence length using DBRTDs.

 


High-Speed Electron Devices Using Advanced Structures and Materials

 

Staffs:     K. Furuya              M. Asada              Y. Miyamoto          M. Watanabe         S. Tamura

Students:         T.Arai                M. Tsutsui         T. Abe      T. Morita       R. Yamamoto              

                     K. Kashima          H. Maeda          K. Matsuda       N. Orihashi     K. Sasao           

                     K. Arai                N. Kaneda         T. Ozono           H. Satoh         K. Takeuchi      

                     K. Yokoyama     E. Hase           T. Iguchi         R. Nakagawa    T. Nonaka

Research Student:   I. Medugorac

 

Superlattices and ultrathin layers with the combination of metal and insulator were proposed as one of the candidates of the material for ultrahigh-speed electronic devices and optical devices because of the low resistivity of metals, low dielectric constant and wide band gap of insulators and high conduction band offset at metal/insulator heterointerface. A novel transistor using quantum interference in metal/insulator heterostructure has been proposed and it was shown theoretically that sub-pico second response could be expected in such devices.

Results obtained up to now are as follows:

 

(1)    In a novel transistor where hot electrons travel through undoped semiconductor region by adopting a combination of double-barrier resonant-tunneling structure and metal wire, we fabricated new structure where emitter was fabricated partially on the top of the device to improve the ratio between collector current and gate current. As a result, high gain over 100 was observed at room temperature.

(2)    In buried metal heterojunction bipolar transistors (BM-HBTs), dependence of the thickness of overgrown layer on number of buried metal wires were studied, moreover, wet-etching process for 0.1ƒÊm-wide emitter was improved to get higher reproducibility. As a result, we fabricated BMHBT with 0.1ƒÊm-wide emitter and confirmed current gain of 20.

(3)    A self-assembled monolayer (SAM) molecule is attractive as an active region of an electron device because of its inherent small thickness (~1-2 nm) between each electrode. We reported processes to fabricate small Au/SAM/Au junctions by using electron beam lithography. As a SAM molecule, we used benzene-1,4-dithiol on Au. To obtain an atomically flat Au electrode without deformation of shape, lower deposition rate, lower sample temperature, and adequate annealing temperature were required. By using a SiO2 pattern as a shadow mask, twice oblique evaporations made small Au/SAM/Au junctions. A minimum feature size of slit of a SiO2 pattern was 60 nm by using electron beam lithography. Si substrate isolated by SiO2 works as a gate electrode of three terminal devices by the Au/SAM/Au junctions. Observed I-V characteristics showed modulation of drain current by gate bias. Reproducible current jump and step-like current modulation were also observed.

(4)    The Schottky source/drain (S/D) MOSFET has the potential for scaling into the nanometer regime, because low electrode resistances with very shallow extension can be realized using metal source/drain. Very short channel Schottky S/D MOSFET with SOI structure were analyzed theoretically. The short channel effect can be suppressed even with a 15 nm-long channel at tOX = 1 nm and tSOI = 3 nm. The very short channel devices with metal gate (ErSi2 for n-type, and PtSi for p-type) were fabricated on SIMOX substrate, and the room temperature operation of sub 50nm devices was demonstrated. For 25 nm-long gate p-type devices, comparable drivability to conventional MOSFETs was archived with the drain current of -293 mA/mm and the transconductance of 431mS/mm at VDS = VGS = -1.5 V. The on/off ration was improved by using a very thin 35nm-thick SOI structure.

(5)    Current change under irradiation of a terahertz electromagnetic wave was measured for a triple-barrier resonant tunneling diodes integrated with a planar patch antenna. Gradual change from the classical square-law detection to photon-assisted tunneling with increasing photon energy was observed. The intersubband THz gain due to electron transition between adjacent quantum wells was estimated using the measurement of current change. Estimated gain at room temperature was ~0.15cm-1 at 1.4THz for a sample with relatively thick separation layer.

(6)    Superradiance from photon-assisted tunneling electrons is analyzed quantum-mechanically, and an amplifier device for the terahertz range utilizing this phenomenon is discussed. In this device, electrons which are transported with the photon-assisted tunneling at the input port generate the amplified output due to the superradiance at the output port. It is shown from the analysis that the gain up to a few terahertz is possible by optimizing the device structure and the impedances at the input and output ports.


Light Emitting Devices Using Advanced Structures and Materials

 

Staff:           M. Watanabe

Students:       T. Maruyama           T. Ishikawa            N. Nakamura         M. Matsusda

                    H. Fujioka              Y. Niiyama             T. Yokoyama          T. Kanazawa

                    K. Jinen                  S. Tamura              R. Ideue

 

New type of light emitting devices using quantum-nano structures are studied. Intersubband quantum cascade lasers using CdF2-CaF2 heterostructures have been proposed and novel crystal growth technique named Nanoarea-Local-Epitaxy has been proposed. Sharp energy subbands in the quantum wells has been confirmed using resonant tunneling diode with double- and triple-barrier structures. Novel candidate for lattice-matched, wide-bandgap compound semiconductor Be-chalcogenides was proposed and epitaxial growth of high-Be-content BeZnMgSe has been demonstrated.

Results obtained in this research are as follows.

 

(1) In order to realize intersubband cascade lasers, it is essential to control energy levels of subbands in CdF2 or Si quantum wells confined by CaF2 energy barriers. This year, Nanoarea-Local-Epitaxy (NLE) was proposed to grow CdF2-CaF2 double-barrier and triple-barrier resonant tunneling diode (RTD) structures. The hole arrays of 50 nm in diameter was formed on a 15 nm-thick SiO2 layer on Si substrate with 0.1‹ off miscutt angle using electron beam lithography. This yields atomically flat Si surface with no atomic steps in growth region, which is essential to grow pinhole-free 1 nm-thick CaF2 for tunneling barrier layers. In the result, uniformity of the I-V characteristics and stability of the device performance was dramatically enhanced. And moreover, control of energy subband has been demonstrated for the first time by changing CdF2-QW thickness even for triple-barrier resonant tunneling diode structures.

(2) Epitaxial growth and room temperature negative differential resistance (NDR) of CdF2-CaF2 double barrier resonant tunneling diode (RTD) on Si(100) substrate was successfully achieved for the first time. Si(100) substrate with misscut angle of 2‹ was used in order to form 2 mono layer silicon atomic steps, i.e. one unit layer, which yields atomically flat CaF2 epilayers on Si(100) substrate with excellent uniformity and reproducibility. Double-barrier RTD structures were fabricated and NDR with peak-to-valley current ratio (PVCR) of around 4 was observed at room temperature for the first time.

(3) Memory effect of CdF2/CaF2 triple barrier resonant tunneling diode structure has been demonstrated using p-type Si substrate. Strong hysteresis of negative differential resistance characteristics were observed and reproduced many times during the bias sweep due to electron charge and discharge. In resonant tunneling, electrons are trapped in CdF2/CaF2 quantum well and discharged by applying reverse bias voltage. Asymmetry of polarity of carrier reservers (top metal electrode and p-type Si substrate) was found to be essential for reproducible hysteresis. This phenomenon strongly suggests the potential of CdF2/CaF2 heterostructures for memory device application.

(4) Be-chalcogenides II-VI semiconductors is good candidate for the materials of long life-time II-VI lasers because of the strong covalent bonding of Be. Moreover, BeMgZnSe quaternary compound semiconductor can be lattice matched to Si and its energy band gap covers UV region (290-345nm). This year, epitaxial growth of high-Mg-content (12-15%) BeMgZnSe lattice matched to GaP (001) substrate has been demonstrated using BeZnSe buffer layer with molecular beam epitaxy (MBE). BeZnSe buffer layers were introduced to suppress phase separation on GaP substrate even at high-Mg and Be content region maintaining lattice match. Full-width at half-maximum (FWHM) (w scan (004)) of Be0.47Mg0.15Zn0.38Se was 662.4 arcsec and that for Be0.48Mg0.12Zn0.40Se was 172 arcsec by X-ray diffraction (XRD). BeZnSe buffer layer was found to be promising for the growth of energy bandgap (~3.90 eV) BeMgZnSe heterostructures on GaP substrate.


Processing for Nanometer Structures

 

Staffs:                   K. Furuya              S. Arai    Y. Miyamoto          M. Watanabe         S. Tamura

Visiting Researcher:                            T. Tanaka

Students: T. Arai    T. Morita R. Yamamoto         H. Nakamura         H. Maeda              K. Matsuda           

Y. Ninomiya      K. Sasao  N. Kaneda             U. Shirai K. Takeuchi           K. Yokoyama

E. Hase            R. Nakagawa         T. Nonaka

 

Study of nanometer structure fabrication technology is important for the realization of quantum effect devices such as quantum-wire, or –box devices and ballistic electron devices based on wave characteristics of electrons.

Results obtained in this research are as follows:

 

An AlInAs layer and high electron mobility transistor (HEMT) structures were grown using low-oxygen-content metalorganic precursors by metalorganic vapor phase epitaxy (MOVPE). The oxygen concentration in the AlInAs layer measured by secondary ion mass spectrometry (SIMS) was 7x1015 cm-3. Moreover, the mobility and sheet carrier concentrations of the AlInAs/InP HEMT structure in which a 2.5 mm-thick AlInAs buffer layer was inserted to reduce the diffusion of impurities from the substrate surface, were 5,500 cm2/Vs and 1.0x1012 cm-2 at 300 K, and 110,000 cm2/Vs and 8.7x1011 cm-2 at 77 K, respectively. For the AlInAs/GaInAs HEMT structure with the same buffer layer, mobility and sheet carrier concentrations were 12,000 cm2/Vs and 1.2x1012 cm-2 at 300 K, and 92,000 cm2/Vs and 1.2x1012 cm-2 at 77 K, respectively.