RESEARCH ACTIVITIES

 

Low Dimensional Quantum Structure Lasers

 

Staffs:    Y. Suematsu              S. Arai       T. Maruyama              S. Tamura

Visiting Researcher: A. Haque

Students:     H. Yagi             K. Ohira           T. Sano            T. Murayama   D. Plumwongrot

                    M. Hirose        K. Miura

 

GaInAsP/InP strained-quantum-film, -wire, and -box lasers have been studied both theoretically and experimentally. A new type of DR (distributed reflector) lasers fabricated by the same fabrication process as that of quantum-wire lasers and distributed feedback (DFB) lasers with wirelike active regions have been also studied.

Results obtained in this research are as follows:

 

(1)      GaInAsP/InP multiple-quantum-wire structures with the wire widths of 18 nm and 27 nm in the period of 80 nm were fabricated by electron beam lithography, CH4/H2-reactive ion etching and two-step organometallic vapor-phase-epitaxial growth. Size distributions of these quantum-wire structures were measured by scanning electron microscope views and the standard deviation was estimated to be less than ±2 nm. From EL spectra at 103 K, the full-width at half maximum of these quantum-wire structures was almost comparable to that of the quantum-film structure fabricated from the same initial quantum-well.

(2)      Wire width dependence of the large energy blue shift in GaInAsP/InP partially strain-compensated vertically-stacked multiple-quantum-wire structures is accurately explained for the first time using an 8 band k•p theory without any fitting parameter. Variations of energy levels due to a non-uniform strain profile in stacked quantum-wires are calculated to be less than 2.4 meV. It is found that unlike quantum films, the energy-band structures of strained quantum-wires depend on the amount of strain-compensation in barrier regions and on the number of wire layers in the vertical stack.

(3)      A RT-CW operation of GaInAsP/InP quantum-wire lasers (23 nm wide, 5 stacked quantum-wires) and wirelike lasers (43 nm wide, 5 stacked wires) fabricated by electron beam lithography, CH4/H2-reactive ion etching and organometallic vapor-phase-epitaxial regrowth was realized for the first time. Lifetime measurement of this quantum-wire laser was also carried out at RT-CW condition, and no noticeable performance degradation was observed even after 9,500 hours.

(4)      GaInAsP/InP strain-compensated 5-stacked compressively strained quantum-wire lasers with the wire width of 14 nm in the period of 80 nm were realized by electron beam lithography, CH4/H2-reactive ion etching and organometallic vapor-phase-epitaxial regrowth. By adopting completely strain-compensating barriers, a smaller energy blue shift at the peak wavelength in EL spectra than that in the case of a partial strain-compensation was observed that indicates the suppression of the strain relaxation effect during etching and InP regrowth process. Lateral quantum confinement effect in this quantum-wire laser could be also observed via sharper shape of the EL spectrum than that of quantum-film lasers in the higher transition energy region.

(5)      GaInAsP/InP multiple-quantum-wire lasers (wire widths of 19 nm and 27 nm in a period of 100 nm) with SiO2/semiconductor reflector by electron beam lithography, CH4/H2-reactive ion etching and two-step organometallic vapor-phase-epitaxial growth. As a result, oscillations from the ground levels could be obtained at RT. In addition, the threshold current densities of these quantum-wire lasers were lower than and differential quantum efficiencies were comparable to those of quantum-film lasers at RT.

(6)      Low threshold operation of 1.55 mm wavelength GaInAsP/InP strongly index-coupled and gain-matched distributed feedback lasers with periodic wirelike active regions, which was fabricated by electron beam lithography, CH4/H2-reactive ion etching, and organometallic vapor-phase epitaxial regrowth, were demonstrated and their reliability was also investigated to date. As a result, no degradations in lasing characteristics were observed after an aging time of 8200 hours at a bias current of around 10 times the threshold. In the experiment, all measured device of this laser oscillated on the long-wavelength side of the stopband. We investigated the single-mode operation of DFB laser with wirelike active regions by using coupled-mode theory. As a result, it was theoretically demonstrated that DFB lasers with wirelike active regions oscillated in the long-wavelength side mode of the stopband by considering the gain-matching effect. The facet phases of two cleaved facets were also investigated. Lasing modes exist on the long-wavelength side for any facet combination.

(7)      We have been studying a new type of distributed reflector laser consisting of a wirelike active section and a passive DBR section with quantum-wire structure by using a lateral quantum confinement effect. To evaluate the reflectivity of the DBR, we fabricated Fabry-Perot type lasers with DBR section on a single side. The reflectivity was estimated from the output ratio from the front to the rear facet. The reflectivity higher than 90 % was achieved at a DBR length of 200 mm for the wire width of 60 nm and 350 mm for 30 nm, where cleaved facet reflectivity of Rf = 0.3 and the refractive index difference of Dn = 0.03 were assumed. Using this DBR structure, DR laser was fabricated with planer type structure by BCB polymer. As a result, threshold current of 3.2 mA was obtained for active section length of 260 mm, passive DBR section length of 130 mm and stripe width of 4.3 mm with both facets cleaved. The differential quantum efficiency from the front facet was 19.2 % and the rear facet was 1.7 %, hence an asymmetric output ratio of 11 was realized. A single-mode operation with sub-mode suppression ratio (SMSR) of 46.6 dB was achieved at a bias current of 3.75 times the threshold.

(8)      The device mentioned above, however, could not operate with high performance theoretically indicated. This result was caused by damage of dry etching to form the stripe. For higher efficiency, wet chemical etching was used to form the laser stripe instead of dry etching. As a result of fabricating the DR laser by wet chemical etching, threshold current of 2.5 mA, which corresponds to the threshold current density of 189 A/cm2, was obtained for the active section length of 300 mm, the passive DBR section length of 210 mm and the stripe width of 4.4 mm. The active and passive sections consist of 90-nm-wire with the period of 240.0 nm and 40-nm-wire with the period of 241.25 nm, respectively. The differential quantum efficiency from the front facet was 35.6 % and the rear facet was 0.54 %. An asymmetric output ratio of 66 was realized. A single-mode operation with sub-mode suppression ratio (SMSR) of 53.7 dB was achieved at a bias current of twice the threshold.

 

 

 


New Types of Semiconductor Lasers for Photonic Integration

 

Staffs:    Y. Suematsu              S. Arai       S. Tamura

Students:     H. –C. Kim       T. Okamoto     Y. Onodera      H. Kanjo          T. Hasegawa  

                    S. Sakamoto    T. Yamazaki                    M. Hirose                            K. Miura

 

Semiconductor lasers with low threshold current, high efficiency, and single wavelength operation are very attractive for optical interconnection and a number of optoelectronics applications. New types of semiconductor lasers, such as Distributed Reflector (DR) lasers and Membrane lasers have been studied both theoretically and experimentally.

Results obtained in this research are as follows:

 

(1)      1.3mm-wide narrow mesa stripe DR lasers consisting of first-order vertical grating (VG)-DFB and first-order deeply etched DBR mirrors were realized for the first time by one-step epitaxy and fine vertical etching processes. A threshold current of 2.8mA for the active region length of 150mm and an SMSR=44dB were obtained.

(2)      In case of TE mode, a narrow stripe waveguide exhibits relatively low coupling coefficient even for deep grating. 1.5mm vertical grating distributed feedback lasers with tensile quantum well were realized single mode operation of TM polarized VG-DFB lasers. A threshold current of 2.6mA and SMSR=50dB were obtained.

(3)      Novel semiconductor laser structure, such as, membrane laser which has the Benzocyclobutene (BCB) cladding layers, enables to increase optical confinement into active layer due to a large refractive index difference between active layer and cladding layers. A room temperature continuous wave operation of membrane DFB laser consisting of deeply etched single-quantum-well wirelike active regions was already demonstrated. In order to realize single mode and low threshold operation of membrane DFB laser, buried heterostructure (BH) was innovated by slightly changing the fabrication process. A threshold pump power of 1.5 mW and a sub-mode suppression-ratio of 42 dB were obtained for a 142 nm-thick semiconductor membrane core layer with a cavity length of 120 mm and a stripe width of 2 mm under room-temperature continuous wave optical pumping. The corresponding threshold for current injection was roughly estimated to be 27 mA.

(4)      We have realized membrane BH-DFB laser arrays by arranging the laser cavities (10 mm spaced 15 elements with 5 different grating periods). A total wavelength span of 72 nm was achieved with a small lasing wavelength fluctuation of up to ±1.2 nm at RT-CW condition under optical pumping. From this value, membrane thickness fluctuation was estimated to be ±0.4 nm. Threshold pump power of 3.4 mW and SMSR of 45 dB were achieved in a typical device.

(5)      Membrane BH-DFB laser arrays with different grating periods and different stripe width were successfully fabricated using EB lithography, CH4/H2-RIE and OMVPE. The possibility for a laser array covering a wide wavelength range of 51 nm with a wavelength controllability of less than 0.8 nm (100GHz) was demonstrated. This multi-wavelength laser array may be a candidate for a coarse WDM system or a wavelength conversion device between LAN and MAN.

(6)      Low threshold operation of membrane buried heterostructure distributed feedback (BH-DFB) laser arrays. 45 devices were fabricated on a wafer covering a wide wavelength range of 75 nm. The lowest threshold pump power as low as 0.64 mW along with the sub-mode suppression-ratio (SMSR) of over 30 dB at 2 times the threshold were successfully obtained at RT-CW condition.

(7)      Phase shifted membrane BH-DFB laser with short cavity length of 50 mm was fabricated and characterized. Threshold pump power of 3.1mW and SMSR of 35dB were achieved with RT-CW condition under optical pumping. Laser cavities were operated under optical pumping at RT-CW using micro PL setup. Stripe width was 2 mm, cavity length was 50 mm, and grating period was 310 nm, respectively. Threshold pump power Pth was 3.1 mW which corresponded to a threshold current Ith of around 70 mA (estimated by assuming an absorption coefficient as 10000 cm-1). An emission wavelength of 1549 nm was observed. Considering the lasing mode as the Bragg wavelength, equivalent refractive index was estimated to be around 2.50 which agreed well with the value calculated from the cross sectional waveguide structure. From the stop band width of 38 nm, index coupling coefficient was estimated to be 710 cm-1.

(8)      Benzosyclobutene (BCB) used for cladding layer of membrane laser structure has negative temperature coefficient of refractive index which is opposing value of semiconductor material. So athermal waveguide can be designed with controlling the thickness of membrane core layer. Membrane BH-DFB lasers with membrane core thickness of 150nm and 65nm were fabricated. Slope of lasing wavelength dependences on temperature were measured to be 0.0526nm/K and 0.0245nm/K, respectively. The value for membrane thickness of 65nm was one in five of typical semiconductor DFB lasers.


Quantum Coherent Electron Devices

 

Staffs:    K. Furuya   Y. Miyamoto              N. Machida              S. Tamura

Students:     K. Mae             H. Nagatsuka   Y. Ninomiya     H. Kanoh                             D. Miyamoto   

                    U. Shirai           T. Kaminosono                    S. Sato                                 Y. Toriumi                           T. Arai

 

Ballistic transport of hot electron has a possibility of new high-speed and functional devices using wave property of electron. We studied wave properties of hot electron for new principle of electron devices.

Results obtained in this research are as follows:

 

(1)  We have carried out Young’s double-slit experiment for the hot-electron wave in man-made semiconductor structures with a 25-nm-space double slit in an InP layer buried within GaInAs, a 190-nm-thick GaInAsP hot-electron wave propagation layer, and a collector array of 80 nm pitch. At 4.2 K, dependences of the collector current on the magnetic field were measured and found to agree clearly with the double-slit interference theory. The present results show evidence for the wave front spread of hot electrons using the three-dimensional state in materials, for the first time, and the possibility of using top-down fabrication techniques to achieve quantum wave front control in materials.

(2)  We gave numerical foundations for previously proposed experiment of hot-electron diffraction observation in solid based on Ballistic Electron Emission Microscope (BEEM). It was found that hot-electron wave function in semiconductor injected from a scanning probe became quasi-spherical wave because of large refraction effect at base metal/semiconductor interface due to large discontinuities of conduction band bottoms and effective masses between each material. Thus, it has been made clear that the quantum reciprocity, our measurement principle, can be applied to our proposed experimental configuration by using BEEM. We have also carried out numerical simulations for our experiment with a p-phase shifter structure as a wave front modulator by Finite Difference Time Domain (FDTD) method. The results showed diffraction patterns with high contrast and our scenario for hot-electron diffraction observation came into existence.

 


High-Speed Electron Devices Using Advanced Structures and Materials

 

Staffs:    K. Furuya   M. Asada    Y. Miyamoto   M. Watanabe   S. Tamura

Post-Doctoral Research Fellow:  Qui Weibin        Z. Y. Zhang

Students:  K. Nishihori  K. Kashima  N. Orihashi  H. Maeda  K. Matsuda 

                     K. Sasao  N. Kaneda  K. Arai  T. Ozono  H. Satoh 

                     K. Takeuchi  K. Yokoyama  S. Gotoh  E. Hase  S. Hattori

                     H. Imai  R. Nakagawa  T. Nonaka  Y. Yamada  T. Fujisaki

                     M. Ishida  H. Kamata  Y. Sugiyama

Research Student:  I. Medugorac

 

Superlattices and ultrathin layers with the combination of metal and insulator were proposed as one of the candidates of the material for ultrahigh-speed electronic devices and optical devices because of the low resistivity of metals, low dielectric constant and wide band gap of insulators and high conduction band offset at metal/insulator heterointerface. A novel transistor using quantum interference in metal/insulator heterostructure has been proposed and it was shown theoretically that sub-pico second response could be expected in such devices.

The terahertz frequency range is remaining undeveloped, in spite of various wide applications, due to the lack of compact solid state amplifiers and oscillators. Terahertz response of quantum nano-structures and its application to terahertz devices are studied. Quantum effect in metal/insulator/semiconductor heterostructures, which are suitable for ultra-high frequency operation, are also studied as well as in semiconductor heterostructures.

Results obtained up to now are as follows:

 

(1)    We proposed and fabricated a hot electron transistor in which an electron propagates only through an intrinsic semiconductor. In this transistor, an emitter mesa was fabricated between gate electrodes to reduce the gate leakage current from the emitter to the gate. To suppress the current leakage from the emitter and the gate pads, free-standing tungsten wires were also fabricated. The measured I-V characteristics at 20K showed effective control of collector current by gate bias. When the device was operated, it was confirmed that the gate-leakage current from the emitter to the gate was smaller than the collector current. The calculated transconductance gm was approximately 10 mS/mm.

(2)    GaInAs/InP heterojunction bipolar transistors (HBTs) with a single 0.1-mm-wide tungsten wire were fabricated. The tungsten wire was buried in an undoped InP collector layer and functioned as a collector electrode. In a previous process of fabricating HBTs with buried wires, we could not achieve a device operation with only a single wire. One of the possible reasons for this failure was the insufficient growth of the buried wire, because this wire requires a long growth time. The nonuniformity of facet formation in a previous wet etching process used to fabricate an InP emitter also contributed to the failure. By increasing the growth time of the buried wire and changing the wet etching solution used to enable uniform fabrication of emitter mesas, we observed a transistor operation with a current gain of 20 in the fabricated HBT. The emitter area of the device was 0.1 x 0.5 mm2.

(3)    The modulation of drain current by gate voltage in a self-assembled monolayer (SAM) of benzene-1,4-dithiol was confirmed on the basis of the transistor structure. A device was fabricated by the shadow mask technique with an air-bridge structure. By electron beam lithography, the top area of the Au/SAM/Au junction was fabricated to be 370 nm by 230 nm. The measured current-voltage characteristics showed an exponential increase in drain current when drain voltage was increased and a decrease in drain current when gate bias was increased. Because the modulated drain current was greater than the gate leakage current, modulation by the gate bias was confirmed. However, no bonding was expected in the upper SAM/Au junction because the magnitude of the drain current was less than 100 pA.

(4)  Superradiance from photon-assisted tunneling electrons is analyzed quantum-mechanically, and an amplifier device for the terahertz range utilizing this phenomenon is proposed. In this device, electrons transported with the photon-assisted tunneling at the input port generate the amplified output due to the superradiance at the output port. It is shown theoretically that the gain up to a few terahertz is possible by optimizing the device structure.

(5)  A novel amplifier device with two-dimensional electron gas in semiconductor heterostructures, which has a possibility of operating in the THz range, is proposed and analyzed. The operation principle is equivalent to that of the klystron tube in the low-frequency classical limit. Transconductance and power gain are analyzed quantum mechanically including the influence of electron scattering and electron energy distribution. Calculated results show that the transconduntance has a peak in the sub-THz and THz ranges. An oscillator using this device integrated with a coplanar line and a slot antenna is proposed, and the possibility of THz oscillation is shown by the analysis of oscillation conditions. Fabrication of this device is now in progress with the layer structure of GaInAs/InAlAs HEMT (high-electron mobility transistor). Fabrication process has been established, and the DC characteristics with sufficient driving current for THz oscillation have been obtained.

(6)  Millimeter and sub-millimeter oscillators with RTDs (resonant tunneling diodes) integrated with stacked-layer slot antennas are proposed, and oscillation at 250GHz is demonstrated with GaInAs/InAlAs RTDs. Detailed electromagnetic analysis is also performed and shows that oscillation up to 1.2THz is feasible by reducing the antenna size.

(7)   Frequency mixing characteristics are examined for 0.8-mm-diameter GaInAs/InAlAs triple-barrier RTDs in 100GHz band. Obtained heterodyne signals by fundamental mixing show that the conversion losses of these diodes are as low as the reported results of the conventional Schottky barrier diodes when the bias voltage is set in the negative differential regions. Epitaxial growth of resonant tunneling structure with CdF2/CaF2 (insulator/insulator) and CoSi2/CaF2 (metal/insulator) super-hetero- structures on Si substrates was established using nano-area local epitaxy, and room-temperature negative differential resistances were obtained with very high uniformity and reproducibility. Details are described in the next category (Light Emitting Devices Using Advanced Structures and Materials).


Light Emitting Devices Using Advanced Structures and Materials

 

Staff:          M. Watanabe

Students:                    M. Matsusda   Y. Niiyama       H. Fujioka       K. Jinen

                    T. Kanazawa   T. Yokoyama   S. Tamura       R. Ideue

                    H. Murata        T. Murata        T. Tabira         Y. Fujisawa

 

New type of light emitting devices using quantum-nano structures are studied. Intersubband quantum cascade lasers using CdF2-CaF2 and CoSi2-CaF2 heterostructures have been proposed and novel crystal growth technique named Nanoarea-Local-Epitaxy has been proposed. Energy subbands in the quantum wells has been confirmed using resonant tunneling diode with double- and triple-barrier structures. Novel candidate for lattice-matched, wide-bandgap compound semiconductor Be-chalcogenides was proposed and epitaxial growth and room temperature UV emission of high-Be-content BeZnMgSe has been demonstrated.

Results obtained in this research are as follows.

 

 

(1) In order to realize intersubband cascade lasers, it is essential to control energy levels of subbands in CdF2 or Si quantum wells confined by CaF2 energy barriers. This year, Nanoarea-Local-Epitaxy (NLE) was proposed to grow CdF2-CaF2 double-barrier and triple-barrier resonant tunneling diode (RTD) structures. The hole arrays of 50 nm in diameter was formed on a 15 nm-thick SiO2 layer on Si substrate with 0.1° off miscutt angle using electron beam lithography. This yields atomically flat Si surface with no atomic steps in growth region, which is essential to grow pinhole-free 1 nm-thick CaF2 for tunneling barrier layers. In the result, uniformity of the I-V characteristics and stability of the device performance was dramatically enhanced. And moreover, control of energy subband has been demonstrated for the first time by changing CdF2-QW thickness even for triple-barrier resonant tunneling diode structures.

(2) Epitaxial growth and room temperature negative differential resistance (NDR) of CdF2-CaF2 double barrier resonant tunneling diode (RTD) on Si(100) substrate was successfully achieved for the first time. Si(100) substrate with misscut angle of 2° was used in order to form 2 mono layer silicon atomic steps, i.e. one unit layer, which yields atomically flat CaF2 epilayers on Si(100) substrate with excellent uniformity and reproducibility. Double-barrier RTD structures were fabricated and NDR with peak-to-valley current ratio (PVCR) of around 4 was observed at room temperature for the first time. Moreover, CdF2 quantum-well thickness dependence of applied bias voltage for NDR peak current has been clearly demonstrated and it was well explained by Esaki-Tsu formula assuming layer thickness fluctuation

(3) CoSi2(Metal)/CaF2(Insulator) triple barrier resonant tunneling diode structure has been demonstrated using Nanoarea Local Epitaxy with hole arrays of 40 nm diameter. Negative Differential Resistance with high peak-to-valley current ratio (PVCR) of 33 at room temperature has been demonstrated for the first time. This value was the highest value ever reported concerning CoSi2/CaF2 heterostructures. This result has strong impact for three-terminal device application using metallic quantum-well as a control electrode.

(4) Be-chalcogenides II-VI semiconductors is good candidate for the materials of long life-time II-VI lasers because of the strong covalent bonding of Be. Moreover, BeMgZnSe quaternary compound semiconductor can be lattice matched to Si and its energy band gap covers UV region (290-345nm). This year, the BeZnSe buffer layer by Migration Enhancement Epitaxy (MEE) was introduced. In the result, that improved the surface morphology, the crystalline quality and the luminescence property. The 40-nm-thick BeZnSe as buffer layer and the 200-nm-thick BeZnSe as epi-layer was grown by MEE and conventional MBE growth mode, respectively. In the photoluminescence (PL) measurements, the full-width at half-maximum (FWHM) at λ= 342 nm was 56 meV at 13K and 82 meV at room temperature, respectively. We can conclude that MEE reduce stacking faults and/or dislocations because MEE suppress agglomeration of Be.

(5) Photoluminescence of quantum-well (QW) structures on the GaP (001) substrate has been demonstrated. The quantum well structure consists of Be0.15Zn0.85Se (compressive) wells with different thickness of 2 nm and 5 nm. Each well was separated by 50-nm-thick Be0.41Zn0.59Se (unstrained) barrier layers. The nearly band-edge emission of Be0.15Zn0.85Se and Be0.41Zn0.59Se were observed 3.42 eV and 3.57 eV at 13K, respectively. Those were assigned to quantum levels in each quantum well.


Processing for Nanometer Structures

 

Staffs:         K. Furuya   S. Arai   Y. Miyamoto   M. Watanabe   S. Tamura

Visiting Researcher:          T. Tanaka

Students:    M. Yoshizawa  H. Maeda        K. Matsuda          Y. Ninomiya    K. Sasao         

N. Kaneda      U. Shirai          K. Takeuchi     K. Yokoyama     S. Gotoh  

E. Hase            R. Nakagawa     T. Nonaka      Y. Yamada

 

Study of nanometer structure fabrication technology is important for the realization of quantum effect devices such as quantum-wire, or –box devices and ballistic electron devices based on wave characteristics of electrons.

Results obtained in this research are as follows:

 

(1)           We investigated the effects of low-oxygen-content metalorganic precursors on oxygen impurities and Hall mobility. The oxygen concentration in the AlInAs layer was less than 2 x 1017 cm-3 under all growth conditions. We confirmed the high mobility of the AlInAs/InP high electron mobility transistors (HEMT) structure with the AlInAs buffer layer (5,500 cm2/Vs at 300 K, and 110,000 cm2/Vs at 77 K). For the AlInAs/GaInAs HEMT structure with the same buffer layer, we obtained the high mobility (12,000 cm2/Vs at 300 K, and 92,000 cm2/Vs at 77 K)

(2)           Line edge roughness (LER) of resist patterns becomes a concern because LER of gate patterns deteriorates the performance and uniformity of device characteristics. We have investigated LER of resist patterns using various electron beam (EB) lithography : 100 keV electron projection lithography (EPL), 50 keV variable-shaped electron beam (VSB) lithography, 50 keV point electron-beam lithography (PB), and 2 keV lowenergy electron-beam proximity projection lithography (LEEPL). LER of chemically-amplified resists and non-chemically-amplified resists are compared using a critical-dimension scanning electron microscope (CD-SEM) to measure LER. Independent of electron energy, LER strongly depended on latent image quality including aerial image quality, resist dissolution contrast, electron scattering blur, etc, even though increasing acid diffusion, i.e. blurring the latent image, monotonically decreased LER of an isolated pattern by smoothing effect of the acid diffusion. The LER differences among the lithography used are due to the difference of the latent image quality, not to the electron energy or resist sensitivity.